@ Synopsys’ Designer Community Expo

MCCI Demonstrates Latest USB Technology at Synopsys’ Designer Community Expo
MCCI's SuperSpeed USB solution and MCCI Catena® 1910 HSIC Tester on Display at SNUG San Jose

ITHACA, USA and SAN JOSE, USA, March 28, 2011

MCCI Corporation, the world's leading developer of USB software solutions for the portable device industry, announces its participation in the Designer Community Expo at the Synopsys Users Group Conference (SNUG® San Jose) in Santa Clara, California, March 28-30, 2011.

"MCCI has been working closely with Synopsys to further the adoption of SuperSpeed USB and USB High-Speed Inter-Chip (HSIC) technologies," explains Terry Moore, MCCI CEO. "For more than two years we've conducted testing between MCCI's software with Synopsys' DesignWare® SuperSpeed USB IP to prove interoperability. This effort has resulted in joint demonstrations at major events such as SNUG."

"Synopsys' collaboration with MCCI helps designers bring the high performance benefits of SuperSpeed USB into their next generation SoCs with less risk and improved time-to-market," said John Koeter, vice president of marketing for the Solutions Group at Synopsys. "We are looking forward to having MCCI demonstrate interoperability between their SuperSpeed USB software drivers and firmware with Synopsys' DesignWare SuperSpeed USB IP at SNUG's Designer Community Expo."

MCCI products supporting Synopsys' DesignWare USB IP include MCCI's end-to-end USB 3.0 SuperSpeed software solution on Synopsys' DesignWare IP, comprising a full xHCI host stack, USB 3.0 device stack, and MCCI Express Disk™ UAS support. The MCCI UAS (USB-Attached SCSI) product is available both as a host driver and as a device stack. In addition, Synopsys' DesignWare USB 2.0 IP is at the core of MCCI's Catena 1910 USB HSIC Tester and Analyzer. The Catena 1910 helps silicon and platform vendors debug and validate their USB 2.0 HSIC implementations.

SNUG and the Designer Community Expo at SNUG are by-invitation events only for Synopsys customers.

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